The Dual In-line Package: A New Way to Pack a Chip

By admin Jun 23, 2023 #Printed circuit board

The semiconductor industry is always looking for new ways to reduce the space, power and cost of package solutions. Today, it seems like almost every component manufacturer is experimenting with some form of the dual in-line package (DILP). This packaging innovation has many potential applications that could revolutionize the way integrated circuits are manufactured and packaged. The DILPS are smaller, more energy-efficient and less expensive than ever before. 

What is an In-Line Package? To understand what a DILP is—and why so many companies are working on this new design—you first need to know what an in-line package entails. In general, packages come in two main formats: stand alone and in-line. A stand-alone package does not require anything else besides space inside the IC packaging machine to be made; however, an in-line package requires a second piece of equipment to be built along with the IC itself.

In-Line Package – A Brief Background

In-line packages are a type of IC packaging design that is a hybrid between a stand-alone and a package that is in-line with the IC. In a traditional in-line package, the IC is placed inside a tape. That is attached to a machine that then places the IC into a printed circuit board (PCB). In a hybrid package, the IC is placed inside a PCB that is then placed inside the tape.

A hybrid in-line package also benefits from the advantages of an in-line package: small size, lower power consumption and flexibility. Hybrid in-line packages can’t compete with the capacity of a full-blown in-line package, but they allow manufacturers to reduce the size of their chips and bring them into smaller spaces. That’s possible because the IC is squeezed into the PCB while the PCB is kept at a fixed height inside the machine. Hybrid in-line packages can also be more flexible because they allow the PCB to be placed at any angle inside the machine.

What is a Dual In-Line Package?

With the hybrid in-line package, several companies began exploring a way to reduce the size of DILPS even further. The way these companies got around the small size issue was to use a hybrid of a hybrid in-line package and an in-line package. For a DIP Assembly, the hybrid in-line package concept is continued with a hybrid of an in-line package and a PCB. The hybrid in-line package puts the IC in a tape and then places the tape inside an in-line package. The PCB is then placed into the tape and becomes part of the package. This hybrid of a hybrid of a hybrid is a dual in-line package.

DILPS: A New Way to Pack a Chip

The hybrid in-line package and dual in-line package are getting a lot of attention in the packaging community. It’s easy to see why: Compared with traditional PCB designs, DILPS offer better density, lower cost, smaller footprints and improved packaging flexibility. DILPS also bring many other advantages to the table. For one, they allow for smaller, more energy-efficient chips.

That’s because DILPS can be implemented with a chip-scale package (CSP) that, compared with a standard PCB, uses up to 90% less energy. Another advantage of DILPS is the ability to create flexible hybrid designs that can be used for different types of chips and industries. For example, DILPS can be used to bring consumer electronics such as microprocessors, memory and sensors into a smaller space.

The Advantages of an In-line Package

Like hybrid in-line packages, a hybrid of an in-line package and a PCB can be implemented to bring more space savings to the table. Hybrid in-line packages can also be used to bring the benefits of an in-line package to the table: Small size, lower power consumption and flexibility. And, like DILPS, hybrid in-line packages can be implemented with a chip-scale package (CSP). That can have a smaller footprint and use up to 90% less energy.

The Disadvantages of an In-line Package

Hybrid in-line packages and DILPs have many advantages, but they also come with some disadvantages. For example, hybrid in-line packages and DILPs are more costly than standard PCBs. And the smaller footprints of hybrid in-line packages and DILPs don’t always allow for the same types of device interconnections as PCBs. Hybrid in-line packages don’t offer the same flexibility as PCBs, either. That’s because hybrid in-line packages are fixed to a specific position inside the machine.

DILPS: An Emerging Technology for Future ICs

Now that we have a better understanding of what DILPS are and why they are so promising. It’s time to take a more in-depth look at how they actually work. The first thing to understand is the concept of etching. This is the process of removing the material that is covering the IC at the chip fabrication facility.

The etching process is done using a cartridge, which has a silicon wafer shape on its bottom. The silicon wafer is then placed on the cartridge and then submerged into the etching solution. The silicon wafer is where the chip pattern is etched away by the silicon etchant, which removes the unwanted material. The IC with the desired pattern is then removed from the silicon wafer and then placed into the DILP.

Conclusion

The semiconductor industry is always looking for new ways to reduce the space, power and cost of package solutions. Today, it seems like almost every component manufacturer is experimenting with some form of the dual in-line package (DILP). This packaging innovation has many potential applications that could revolutionize the way integrated circuits are manufactured and packaged. The DILPS are smaller, more energy-efficient and less expensive than ever before.

 

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